The article discusses the shift in the semiconductor industry from traditional methods to new technological solutions like Heterogeneous Integration (HI). HI involves advanced packaging techniques to integrate independently designed components using the most suitable process technology. However, it introduces design and security challenges. The article points out the need for research and development in advanced packaging to enable HI and discusses the potential security threats in the advanced packaging supply chain. The authors suggest that the US government is making efforts to bring semiconductor fabrication facilities onshore to deal with the increasing demand for semiconductors and ensure a secure supply chain. However, US-based advanced packaging capabilities must also be enhanced to fully realize this vision.
Publication date: 19 Oct 2023
Project Page: Not provided
Paper: https://arxiv.org/pdf/2310.11651
